Qualcomm Snapdragon 855 Confirmed to be Built on 7nm Process

Huawei has already confirmed to unveil the Kirin 980 Chipset at the upcoming IFA 2018. It will be world’s first commercially available 7nm chipset. Now, Qualcomm also confirms that its next-gen flagship Mobile Platform will be feature 7nm SoC. While there is no official confirmation, we expect it to the successor to the Snapdragon 845 to be called as Snapdragon 855. The company will be using the TSMC’s 7nm FinFET process technology to build its new flagship chipset.

Even the Huawei also opted for the TSMC’s 7nm node for its HiSilicom Kirin 980 processor. Qualcomm, on the other hand, is adopting the 10nm FinFET processor for its mid-range offerings. The Qualcomm Snapdragon 855 will come equipped with Snapdragon X50 5G modem making it the world’s first 5G-capable mobile processor. It also confirmed that the samples are already provided for its partner OEMs to use them in developing their next-gen flagship smartphones.

We might be seeing the Snapdragon 855-powered smartphones during the MWC in February 2019 in Barcelona. Along with Qualcomm and Huawei, Samsung should also jump on to the 7nm bandwagon with its next-gen Exynos chipset. In the past few months, Qualcomm unveiled the new Snapdragon 710 and Snapdragon 670 Mobile Platforms built on a 10nm Finfet process. Stay tuned on PhoneRadar for more details!

The post Qualcomm Snapdragon 855 Confirmed to be Built on 7nm Process appeared first on PhoneRadar.