Honor 8X Retail Box Leaked, Might Come Powered by 12nm Kirin 710 SoC

Honor will soon launch the Honor 8X smartphone as the successor to the Honor 7X smartphone. The X-series from Honor has always offered best in class specifications for the budget users. Now, the retail box of the upcoming Honor 8X is leaked online. While there is no official confirmation from the company, we expect the official launch to happen very soon. The ARE-AL00 smartphone which is recently certified by TENAA in China might be the model number of Honor 8X.

Since there is no official confirmation, take these details with a pinch of salt. The images on the TENAA listing reveals the device to come with a V-shaped notch. It looks similar to the waterdrop screen introduced with the recently launched OPPO F9. Unlike the previously launched X-series devices, the upcoming Honor 8X might come with a glass back body. While there is a 2.5D glass on the front, the company has opted for the 3D curved glass on the rear.

Under the hood, the Honor 8X might come powered by the newly announced HiSilicon Kirin 710 octa-core processor built on the 12nm FinFET process. The Huawei Nova 3i is the only smartphone to use this new chipset. It comes coupled with Mali-G51 MP4 GPU which is said to be 1.3x faster than the GPU on Kirin 659. The Kirin 710 also supports dual SIM dual VoLTE for using two VoLTE-enabled SIMs. It comes with 4GB of RAM and 64GB of internal storage that can be expandable additionally up to 256GB.

In the camera department, the Honor 8X sports 16MP + 2MP dual rear cameras with LED flash and an 8MP single front camera for selfies. The device is mentioned to be backed by a huge 4,900mAh battery and should also support fast charging. Connectivity options include 4G LTE, Wi-Fi, Bluetooth 5.0, GPS, and 3.5mm audio jack. The Honor 8X measures 177.57 x 86.24 x 8.13 mm and weighs around 210 grams. Stay tuned on PhoneRadar for more details!

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